The Low Pressure Moulding process has its origin in the sealing of cable harnesses in the automotive industry - today it is used in many areas for the protection of electrical and electronic components.
At 5 - 60 bar, processing takes place at a significantly lower pressure than in the classic Injection Moulding process. This makes it possible to directly encase sensitive components such as circuit boards, sensors, etc.
The cycle times are limited to the moulding cycle, which, depending on the size and contour of the components, is around 10-60 seconds. Direct further processing is then possible, which means a clear time advantage compared to e.g. 2-component potting.
The adhesive properties of the materials used enable the components to be protected up to IP68 with the right combination of materials.
Thanks to an optimized material flow, hotmelt molding with the thermoplastics used can also be implemented for temperature-sensitive components.
Different material properties and processing variants, combinations of different materials and, if necessary, further process steps enable a wide range of applications.
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LPM in a nutshell
- Low pressures
- Short cycle times
- No curing or reaction times
- Housings can be replaced
- Suitable as strain relief
- Applicable for temperature-sensitive components
- Operating temperatures -50°C - + 150°C
- Impermeability up to IP68
- Wide range of applications
We would be happy to organize technology trainings for you and your colleagues to get to know the possibilities and evaluate the use cases in your company - on site or online from the OptiMel Studio.
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