Low pressures, short processing cycles and immediate further processing without additional curing or reaction times make Low Pressure Molding an efficient protection for electrical and electronic components.
The thermoplastic hotmelts are characterised by their adhesive properties and their low viscosity. Various types of material with a range of specific properties are available.
Tools, specially designed for the Low Pressure Moulding process, take into account the technology and project requirements, down to the last detail. This enables results for the highest quality requirements.
The right service for every project step: Extensive project advice, prototyping, calculation of the matching production equipment, technology introduction up to numerous maintenance and support options.
Your partner for machines and production materials
Based on years of experience and with the aim of maximum flexibility, we have developed a machine system that is oriented towards the respective requirements.
We no longer built any standard models - our modular system including machines and accessories can be precisely tailored to your projects and production conditions.
Please, find the suitable equipment for your project here,
We deliver all available Technomelt® materials for the Low Pressure Moulding technology - with flexible and service-oriented offers for your respective project.
Samples are just as possible here as individual delivery quantities and delivery schedules, through to annual framecontracts with corresponding special conditions.
Find the right material here,
Our service for your projects
The introduction of new technologies begins long before the required production equipment is purchased. We will advise you from the start, share detailed knowledge of the technology and carry out feasibility analyses.
We analyze the matching moulding material based on your requirements, carry out spot tests for adhesion analysis and create prototype tools for test samples and pre-series production.
At the heart of every project, many details are crucial for a stable and efficient process. We advise on component design, manufacture high-quality tools and carry out mold flow analyzes.
Cycle times, pressure, processing and mold temperatures play a decisive role in project-related process design. We determine these parameters and advise on the optimization of ongoing projects.
Suitable equipment is defined by the specification of the project, production conditions and, if applicable, future projects. The configuration is aligned to your requirements based on the modular machine programme and extensive accessories.
With advice on process optimization, training for your staff, various maintenance options and spare parts service, you can also make use of our know-how and support during a running production.
Would you like to get to know us or use our services without the effort of travelling ?! - We can switch you into our studio and it's almost like you're there.
Whatever demands and challenges your project has - our team is here for you:
+49 2371 - 1597 0
What pioneers consider important
For us, it is not only important what we do - full service in Low Pressure Moulding - and why we do it - in order to offer our customers an optimal solution for the protection of electrical and electronic components - but also how we do it - with awareness and responsibility for our environment and ourselves. We are convinced that everyone contributes to what kind of world we will live in in the future. That is why we want to live up to our responsibility as a company in the industrial state of North Rhine-Westphalia and, with our commitment and our decisions, contribute to sustainable business that is oriented towards the common good.
Picture: Wiesner Messearchitektur GmbH
Live and always with the latest news, we present the Low Pressure Molding technology for electronics molding every year at various events.Both at trade fairs and in talks at workshops, congresses and symposia with different industry focuses, we show the process and equipment in detail and offer individual exchange on the requirements in a wide variety of applications. We have already planned the following dates for 2023: Henkel AEI Electro Days – Expert Talks LPM March 13th in DüsseldorfSmans NV Cable and Wire Inhouse Show March 14th – 16th in Turnhout BE Smans | Cable & Wire In-house Show 2023Kunteno May 9 th – 11 th in Rheda-Wiedenbrück - KUTENO Productronica November 14 th –17 th in Munich productronica | Trade fair electronics development production… further events will follow.Low Pressure Molding (LPM) is a process for electronics molding, means protection of electrical and electronic components (such as printed circuit boards or sensors) against vibrations and shocks. LPM insulates against heat, cold, moisture, weather in general and electrical energy. The design is space-saving, cost-effective and individually designable.Thermoplastic hot melt adhesives are used as molding compounds. The predominantly pollutant-free materials based on dimer fatty acids are liquefied by heating. They can be introduced into moulds at low pressures and solidify when cooled.Against the backdrop of increasingly compressed installation space and growing power densities, the demands on the design of electric and electronic components are rising. Encapsulation processes and materials are among the decisive factors for the durability of electrical and electronic assemblies.Originally developed for and in collaboration with the automotive industry, the process has now become an established manufacturing technology in many areas of electronics production and is used in various industries. You can also find more information in our detailed white paper:
After a 4-year break and electronica virtual in 2020, electronica Munich will open its doors again.OptiMel presents the Low Pressure Moulding technology for efficient protection of electrical and electronic components in its entire range. And as always, we also show new developments.We look forward to meeting customers and partners there again, making new contacts, discussing projects and having intensive talks.We cordially invite you to visit us in hall A 2 booth 301 - you can request your personal ticket voucher via our contact form.
On the one hand, electronic components are becoming smaller and smaller and, on the other hand, are generating more energy. Accordingly, heat dissipation is an absolute necessity.Two innovations in the field of Low Pressure Moulding ensure that media-tight moulding to protect the electronics and the targeted removal of heat generated are not mutually exclusive.OptiMel will present the basics of Low Pressure Moulding as a technology for the efficient protection of electrical and electronic components as well as the specific possibilities for processing power electronics in a lecture at the Cooling Days as part of the "Power of Electronics" event on 19.10.2022 at the Vogel Congress Centre in Würzburg.