LPM in DICHT! magazine18.Nov 2021
The new DICHT! magazine was published on November 18, 2021 - the trade journal on all aspects of sealing and gluing.
Low Pressure Moulding - represented by OptiMel - is presented in 2 statements as an interesting alternative to classic sealing solutions (pages 12 and 18).
A comprehensive article will be published in the upcoming magazine 1.2022 , which will illuminate the LPM, its possibilities and advantages in the area of electronic moulding in detail.
As part of the Connector Congress 2019, Elektronikpraxis Vogel reports on Low Pressure Moulding in the 3rd special edition of the electronic mechanics magazine.
With a detailed article the Isgatec Yearbook Sealing. Glue. Polymer.2023 introduces Low Pressure Moulding.In addition to the basics of the technology, typical applications, physical fundamentals, materials used, tools, machine systems, process and innovations are examined in detail.